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TULPAR / PCBA

Custom stencils for SMD assembly

Controlled solder paste application for consistent assembly.

The stencil determines where and how much solder paste is deposited on the PCB. We help specify a stencil based on your board layout, printing equipment and assembly process.

Illustrative framed solder paste stencil

Service advantages

Precision laser cutting

Apertures are laser-cut to match fine and complex pad patterns.

Material and frame options

We assess stainless steel, Kapton film and other project-specific options. A 584 × 584 mm framed steel stencil is available.

From prototype to volume production

We offer stencil options matched to your printing equipment and board dimensions, from single-board prototypes to volume production.

Delivery planning

We confirm lead times at the quotation stage based on your production schedule.

Consistent solder paste printing

We assess foil thickness and aperture dimensions against your pad and component layout to support consistent paste volume and distribution.

Why Tulpar?

  • Production aligned with industry standards
  • Coordination with PCB design and SMD assembly
  • Project-based pricing
  • Technical support for file, foil and frame selection

What to share for a quote

Share the Gerber paste layer (top, bottom or both), board or panel dimensions, and your frame and foil thickness preferences, if known.

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