Technical criteria
Standard and advanced options are reference criteria. The applicable combination is confirmed when we review your files.
Materials and panels| Parameter | Standard | Advanced |
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| Panel size | 450 × 550 mm | On request |
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| Base material | FR4, CEM1, CEM3, IMS | On request: high Tg, Rogers, Teflon, ceramic, PI, Taconic, Arlon |
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| Base material thickness | 0.8–2 mm | On request |
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| Inner core thickness | 0.7–1.2 mm | 0.1–1.6 mm |
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| Prepreg thickness | 1080: 70 µm · 7628: 180 µm | On request |
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| Flex board layer thicknesses | Polyimide 25 µm, copper 18–35 µm, coverlay 25 µm | On request |
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Copper thickness| Parameter | Standard | Advanced |
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| Inner layers | 18 or 35 µm | On request |
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| Outer layers | 35 or 70 µm | 70 µm and above |
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Surface and legend options| Parameter | Standard | Advanced |
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| Solder mask | Green, black, white, blue, red | Orange, purple, brown |
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| Legend printing | White, blue, black | Orange, yellow, gray, red |
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| Surface finish | Lead-free HASL, 63/37 HASL, OSP, ENIG | ENEPIG, immersion tin, immersion silver, hard gold |
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Mechanical criteria| Parameter | Standard | Advanced |
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| Hole / slot · IMS | 1.5 / 2 mm | 1.2 / 1.5 mm |
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| Hole / slot · FR4, CEM1, CEM3 | 0.3 / 0.7 mm | 0.2 / 0.5 mm |
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| Hole aspect ratio | 8 | 10 |
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| Milling | 1.5–2 mm | 1–1.5 mm |
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| V-cut angle | 30° | — |
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| Bevel angle range | 20°–60° | — |
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Special options
Carbon printing, peelable mask, blind and buried vias, via plugging, filled and capped vias, chamfering, countersinking and impedance control.